MaxCore™ 平台功能齐备且高密度的计算和媒体平台




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MaxCore™ Platform

SMART Embedded Computing的 MaxCore™ 平台采用功能齐备且密度高(JW:高密度)的架构,能实现最大计算和媒体处理密度。它通过使用SMART Embedded Computing微服务器卡、SMART Embedded Computing媒体处理 PCI Express 卡和第三方 PCI Express 卡,既可以为数据中心也可为运营商级应用,实现最大灵活性、最高机架密度 (RU) 和无与伦比的创新设计。

2016 Product of the Year Award Network Builders Award



  • 3U x 508mm,适合 19” 机架
  • 90-264VAC 或 -48VDC 的冗余 2200W
  • 3U 下实现最高性能密度,配备 15 个适合SMART Embedded Computing SharpServer™ 微服务器卡的插槽,共有 30 个处理器(每张卡两个)
  • 冗余和热插拔冷却和电源
  • 无缆内部架构,适合微服务器卡
  • SMART Embedded Computing SharpServer Intel® Xeon® 处理器 D 微服务器卡
  • PCI Express 和以太网网络基础架构
  • 4 x 2.5” 驱动盘位和 4x 10GBaseT 内置
  • 符合 NEBS 和 ETSI 规范
  • 可进行多系统配置:微服务器、SMART Embedded Computing媒体处理器和第三方 PCI Express 卡任意搭配

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SMART Embedded Computing (formerly Artesyn Embedded Computing) is part of the SMART Global Holdings, Inc family of companies.

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